币游·国际(中国游)官方网站

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0574-58121888
Service Support Service Support

Service Support

  • Substrate Design
  • Lead-Frame Design
  • Wafer Package Design

  • WBBGA/LGA

    FCBGA/FCCSP

    SiP Module

  • QFN

    QFP

  • Cu pillar/Solder Bump

    Fan In/Out

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